The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Jan. 23, 2018
Applicant:
Nitto Shinko Corporation, Sakai-shi, Fukui, JP;
Inventors:
Akihiro Tabuchi, Sakai, JP;
Tatsuya Inagaki, Sakai, JP;
Assignee:
NITTO SHINKO CORPORATION, Sakai-shi, JP;
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C09J 5/00 (2006.01); C08G 59/24 (2006.01); C08G 59/56 (2006.01); C08G 59/50 (2006.01); C09J 11/04 (2006.01); C08G 59/02 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08G 59/02 (2013.01); C08G 59/245 (2013.01); C08G 59/504 (2013.01); C08G 59/56 (2013.01); C09J 5/00 (2013.01); C09J 11/04 (2013.01); C09J 2400/10 (2013.01); C09J 2409/00 (2013.01); C09J 2463/00 (2013.01); C09J 2471/00 (2013.01); C09J 2479/02 (2013.01);
Abstract
Provided is a reaction-curable adhesive that exhibits an excellent adhesive strength even under a low-temperature environment. The reaction-curable adhesive includes an epoxy compound and an amine compound, the reaction-curable adhesive being cured through a reaction between the epoxy compound and the amine compound, in which a compound having a specific molecular structure is used as at least one of the epoxy compound or the amine compound.