The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Aug. 01, 2018
Interface Technology (Chengdu) Co., Ltd., Chengdu, CN;
Interface Optoelectronics (Shenzhen) Co., Ltd., Shenzhen, CN;
General Interface Solution Limited, Miaoli County, TW;
Sheng Che Chen, Shenzhen, CN;
Yi-Hung Ho, Shenzhen, CN;
Interface Technology (Chengdu) Co., Ltd., Chengdu, Sichuan, CN;
Interface Optoelectronics (Shenzhen) Co., Ltd., Shenzhen, Guangdong, CN;
General Interface Solution Limited, Miaoli County, TW;
Abstract
A glue filling method for a multilayer thin film sensor structure is disclosed herein. Two outer layers of a composite heat-resistant membrane are carved to have desired patterned holes; an inner layer is interposed between two outer layers to form a layered structure. The composite heat-resistant membrane is stuck onto the multilayer thin film sensor structure with the patterned holes aligned to an electric-conduction through-hole of the multilayer thin film sensor structure to form a filling region. A conductive glue is filled into the filling region. Sustained by the inner-layer heat-resistant membrane, the conductive glue protrudes from the patterned hole to cover a portion of the conductive metals on the surface of the multilayer thin film sensor structure. Thereby are simultaneously achieved a water-proof effect, an airtight effect and a fine interface compatibility.