The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Jun. 10, 2019
Kaneka Corporation, Osaka, JP;
Masato Fujita, Hyogo, JP;
Tomomichi Hashimoto, Osaka, JP;
KANEKA CORPORATION, Osaka, JP;
Abstract
A thermoplastic modacrylic resin composition includes a modacrylic resin and a plasticizer. The modacrylic resin includes 15 to 85 wt % of acrylonitrile, 15 to 85 wt % of vinyl chloride and/or vinylidene chloride, and 0 to 20 wt % of another vinyl monomer, and the plasticizer is an organic compound that is compatible with the modacrylic resin and has a boiling point of at least 200° C. A method for manufacturing a thermoplastic modacrylic resin composition includes melt-kneading a powder mixture obtained by mixing a modacrylic resin powder and an organic compound that is compatible with the modacrylic resin and has a boiling point of at least 200° C. Acrylic fibers are composed of a thermoplastic modacrylic resin composition.