The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 25, 2020

Filed:

Sep. 14, 2018
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Andrew Scott Kessie, Springboro, OH (US);

Rebecca Evelyn Hefner, Simpsonville, SC (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B64F 5/60 (2017.01); G06Q 10/06 (2012.01); G07C 5/00 (2006.01); G08G 5/00 (2006.01); B64F 5/00 (2017.01);
U.S. Cl.
CPC ...
B64F 5/60 (2017.01); G06Q 10/06 (2013.01); G07C 5/008 (2013.01); G08G 5/0091 (2013.01); B64F 5/00 (2013.01);
Abstract

Systems and methods for assessing and quantifying the environmental impact on a mechanical component are provided. In one embodiment, a method can include receiving one or more first set(s) of data from one or more first data acquisition system(s) configured to communicate with an onboard system of an aircraft. The method can further include receiving one or more second sets of data from one or more second data acquisition systems that are remote from the aircraft. The method can include determining an aggregate amount of the environmental condition experienced by a mechanical component of the aircraft based at least in part on the first sets of data and the second sets of data. The method can include predicting a level of distress associated with the mechanical component based at least in part on the aggregate amount of the environmental condition experienced by the mechanical component.


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