The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Nov. 15, 2017
Applicant:
Samsung Display Co., Ltd., Yongin-si, Gyeonggi-do, KR;
Inventors:
Ilyoung Jeong, Yongin-si, KR;
Gyoowan Han, Yongin-si, KR;
Jaeil Kim, Yongin-si, KR;
Kuhyun Kang, Yongin-si, KR;
Soobum Park, Yongin-si, KR;
Assignee:
Samsung Display Co., Ltd., Yongin-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2014.01); B23K 26/082 (2014.01); B23K 26/03 (2006.01); B23K 26/08 (2014.01); B23K 26/402 (2014.01); C03B 33/04 (2006.01); C03B 33/09 (2006.01); B23K 26/0622 (2014.01); B23K 26/04 (2014.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
B23K 26/38 (2013.01); B23K 26/03 (2013.01); B23K 26/04 (2013.01); B23K 26/0622 (2015.10); B23K 26/082 (2015.10); B23K 26/0853 (2013.01); B23K 26/0876 (2013.01); B23K 26/402 (2013.01); C03B 33/04 (2013.01); C03B 33/091 (2013.01); B23K 2103/54 (2018.08);
Abstract
A laser cutting apparatus and a laser cutting method are provided. A laser cutting method includes: preparing an object on a stage; cutting the object into a set shape by relatively moving and irradiating a laser beam along the set shape with respect to the object; and performing uniform heating compensation to reduce accumulation of thermal energy of the laser beam resulting from a change of speed at a shift point where a travelling direction of the laser beam with respect to the object changes.