logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10750815 B1

PDFFull Text
Date of Patent:
Aug. 25, 2020

Filed:

Mar. 11, 2011

Sheet for shoe sole and shoe sole including the same

Applicants:

Mitsuteru Mutsuda, Himeji, JP;

Hiroaki Arita, Himeji, JP;

Tomohiro Kawahara, Himeji, JP;

Inventors:

Mitsuteru Mutsuda, Himeji, JP;

Hiroaki Arita, Himeji, JP;

Tomohiro Kawahara, Himeji, JP;

Assignee:

DAICEL-EVONIK LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

John D Freeman

Int. Cl.
CPC ...
A43B 13/02 (2006.01); A43B 13/04 (2006.01); B32B 25/08 (2006.01); B32B 27/34 (2006.01); B32B 27/40 (2006.01); A43B 13/12 (2006.01); A43B 13/24 (2006.01); B29D 35/14 (2010.01); B29C 35/02 (2006.01); C08G 69/26 (2006.01); C08L 77/06 (2006.01);
U.S. Cl.
CPC ...
A43B 13/023 (2013.01); A43B 13/026 (2013.01); A43B 13/04 (2013.01); A43B 13/12 (2013.01); A43B 13/24 (2013.01); B29C 35/0222 (2013.01); B29D 35/142 (2013.01); B32B 25/08 (2013.01); B32B 27/34 (2013.01); B32B 27/40 (2013.01); C08G 69/26 (2013.01); C08L 77/06 (2013.01); B32B 2437/02 (2013.01);
Abstract

A sheet for forming a shoe sole, useful for efficiently joining a crosslinked rubber layer as a stud and a thermoplastic elastomer layer as a sole, is provided. The sheet comprises a resin component (A) containing a polyamide resin (a) and having an amino group concentration of not less than 10 mmol/kg and a flexural modulus of not less than 300 MPa in accordance with ISO178. The polyamide resin (a) may contain a polyamide resin having a melting point of not less than 165° C. at a predetermined concentration (e.g., not less than 30% by weight) in the total polyamide resin (a).

Find Patent Forward Citations

Mutsuda, Mitsuteru. (2020). Sheet for shoe sole and shoe sole including the same (U.S. Patent No. 10750815). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10750815

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…