The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Dec. 16, 2016
Applicant:

Mitsubishi Electric Corporation, Chiyoda-ku, JP;

Inventors:

Soma Egami, Tokyo, JP;

Hiroaki Matsuoka, Tokyo, JP;

Yukari Saito, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01Q 21/00 (2006.01); H01Q 3/26 (2006.01); H01Q 23/00 (2006.01); H01Q 1/02 (2006.01); H01L 23/473 (2006.01); F28F 3/06 (2006.01); F28F 13/14 (2006.01); H01L 23/427 (2006.01); F28F 3/12 (2006.01); F28F 13/08 (2006.01); F28F 1/40 (2006.01); H01L 23/373 (2006.01); F28F 3/04 (2006.01); F28D 21/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20509 (2013.01); F28F 3/06 (2013.01); F28F 3/12 (2013.01); F28F 13/08 (2013.01); F28F 13/14 (2013.01); H01L 23/427 (2013.01); H01L 23/473 (2013.01); H01Q 1/02 (2013.01); H01Q 3/26 (2013.01); H01Q 21/0025 (2013.01); H01Q 21/0087 (2013.01); H01Q 23/00 (2013.01); H05K 7/20 (2013.01); F28D 2021/0029 (2013.01); F28F 1/40 (2013.01); F28F 3/048 (2013.01); H01L 23/373 (2013.01); H01L 23/3736 (2013.01);
Abstract

A phased array antenna in which a plurality of blocks each having a plurality of transmitter modules are arrayed, includes: a front plate that includes a plurality of flow paths of a refrigerant therein; and an element feeding layer that includes a plurality of antenna elements respectively connected to the transmitter modules and that is placed in close contact with one surface of the front plate. Each of the blocks includes a heat spreader that is placed in close contact with the other surface of the front plate. The transmitter modules are mounted on the heat spreader. Heat generated in the transmitter modules is transferred to the refrigerant via the heat spreader and the front plate.


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