The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Aug. 31, 2018
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Sean Charles Andrews, Solana Beach, CA (US);

Seong Heon Jeong, Tuscaloosa, AL (US);

William Henry Von Novak, III, San Diego, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); C09K 5/00 (2006.01); G06F 1/20 (2006.01); C09K 5/06 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20381 (2013.01); C09K 5/063 (2013.01); G06F 1/206 (2013.01); H05K 7/20327 (2013.01); H05K 7/20409 (2013.01); H05K 7/20518 (2013.01); H05K 7/20836 (2013.01); G06F 2200/201 (2013.01);
Abstract

Disclosed is a method and apparatus for mitigating temperature spikes and dissipating heat. The apparatus for mitigating temperature spikes and dissipating heat comprises one or more heatsinks, one or more sensors, one or more phase change materials and one or more processors coupled to the one or more sensors. The one or more processors may be configured to obtain one or more sensor measurements and may be configured to determine whether to store heat or dissipate heat based on the one or more sensor measurements. In response to a determination to dissipate heat, the one or more processors may be configured to dissipate heat from the one or more processors, the one or more phase change materials or both using the one or more heatsinks. Furthermore, in response to a determination to store heat, store heat from the one or more processors using the one or more phase change materials.


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