The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Apr. 03, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Joseph Kuczynski, North Port, FL (US);
Timothy Tofil, Rochester, MN (US);
Jeffrey N. Judd, Oronoco, MN (US);
Matthew Doyle, Chatfield, MN (US);
Scott D. Strand, Rochester, MN (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 3/10 (2006.01); H05K 3/38 (2006.01); H01L 21/02 (2006.01); H05K 3/42 (2006.01); H05K 1/02 (2006.01); H05K 3/40 (2006.01);
U.S. Cl.
CPC ...
H05K 3/386 (2013.01); H01L 21/02118 (2013.01); H05K 1/0292 (2013.01); H05K 3/4069 (2013.01); H05K 3/429 (2013.01); H05K 1/0251 (2013.01); H05K 1/0298 (2013.01); H05K 2201/0329 (2013.01); Y10T 29/49165 (2015.01);
Abstract
A triggering condition is applied to a conductive polymer positioned in a drilled hole in a printed circuit board. The applied triggering condition causes the polymer to vertically expand within the drilled hole such that the expanded polymer creates an electrically conductive path between contact pads located in different layers of the printed circuit board.