The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Aug. 21, 2019
Applicant:

Keysight Technologies, Inc., Santa Rosa, CA (US);

Inventors:

Michael John Harriman, Santa Rosa, CA (US);

Ryan Michael Avella, Santa Rosa, CA (US);

Leonard M. Weber, Bodega Bay, CA (US);

Brian R. Hutchison, Windsor, CA (US);

Naveed Edalati, Santa Rosa, CA (US);

David Massie, Santa Rosa, CA (US);

Rodrik Jon Lund, Santa Rosa, CA (US);

Connie Van Schaick, Santa Rosa, CA (US);

Assignee:

Keysight Technologies, Inc., Santa Rosa, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); H05K 3/10 (2006.01); H05K 5/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 3/103 (2013.01); H05K 5/0008 (2013.01); H05K 7/20454 (2013.01);
Abstract

A method of assembling a fully detachable microcircuit starts with obtaining a fabricated microcircuit housing with an upper surface, a lower surface, a first recess in the upper surface, a second recess in the lower surface, and a pin on the lower surface. A thermal layer is applied to the lower surface. A conductive elastomer signal pin connector and a ground pin connector are attached to a thin film circuit, and the thin film circuit with is inserted into the second recess with the conductive elastomer signal pin connector and the ground pin connector attached. A bonding target is applied to the upper surface. The bonding target and the microcircuit are connected with a bond wire. The microcircuit housing is screwed to a printed circuit assembly without bonding the microcircuit housing to the printed circuit assembly.


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