The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Sep. 12, 2018
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Ji-Hwang Kim, Cheonan-si, KR;

Hyo-Eun Kim, Busan, KR;

Jong-Bo Shim, Asan-si, KR;

Cha-Jea Jo, Yongin-si, KR;

Sang-Uk Han, Asan-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/369 (2011.01); H04N 5/225 (2006.01); G02B 5/20 (2006.01); H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H04N 5/379 (2018.08); G02B 5/20 (2013.01); H01L 27/14618 (2013.01); H01L 27/14625 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01);
Abstract

A substrate structure for an image sensor module includes a module substrate including a sensor mounting hole, a reinforcing plate on a lower surface of the module substrate, an image sensor chip on the reinforcing plate within the sensor mounting hole, and a reinforcing pattern in the module substrate. The reinforcing plate covers the sensor mounting hole. An upper surface of the image sensor chip may be exposed by the module substrate. The reinforcing pattern is adjacent to the sensor mounting hole and extends in at least one direction.


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