The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Mar. 17, 2017
Applicant:

Sony Corporation, Tokyo, JP;

Inventor:

Toshiaki Iwafuchi, Kanagawa, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/225 (2006.01); H04N 5/374 (2011.01); G03B 11/00 (2006.01); H01L 27/146 (2006.01); G03B 17/02 (2006.01); H04N 5/357 (2011.01);
U.S. Cl.
CPC ...
H04N 5/2252 (2013.01); G03B 11/00 (2013.01); G03B 17/02 (2013.01); H01L 27/14618 (2013.01); H01L 27/14621 (2013.01); H01L 27/14625 (2013.01); H04N 5/2253 (2013.01); H04N 5/2254 (2013.01); H04N 5/2257 (2013.01); H04N 5/3572 (2013.01); H04N 5/374 (2013.01); H01L 27/14649 (2013.01);
Abstract

The present disclosure relates to a camera module capable of achieving a smaller height, a method of manufacturing a camera module, an imaging apparatus, and an electronic apparatus. An imaging device having its imaging surface bonded to a provisional substrate is attached, and the imaging device in that state is joined to a substrate via an electrode having a TSV structure. After the provisional substrate is detached, an IR cut filter (IRCF) on which a light blocking film is printed or jet-dispensed in a region other than the effective pixel region is bonded to the imaging surface via a transparent resin. Because of this, there is no need to provide any sealing glass in the stage before the imaging surface, and the optical length of the lens can be shortened. Thus, a smaller height can be achieved. The present disclosure can be applied to camera modules.


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