The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

May. 21, 2019
Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Ji-Hoon Park, Sunnyvale, CA (US);

Yido Koo, Belmont, CA (US);

Jeongsik Yang, San Jose, CA (US);

Wei-Han Cho, Milpitas, CA (US);

Xiaoyu Wang, Santa Clara, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03B 5/12 (2006.01); H03L 7/099 (2006.01); H03L 7/093 (2006.01); H01L 27/02 (2006.01);
U.S. Cl.
CPC ...
H03B 5/1212 (2013.01); H01L 27/0207 (2013.01); H03L 7/093 (2013.01); H03L 7/099 (2013.01); H03B 2200/004 (2013.01); H03B 2200/005 (2013.01); H03B 2200/009 (2013.01); H03B 2201/025 (2013.01); H03B 2201/0208 (2013.01);
Abstract

Certain aspects relate to a semiconductor die. The semiconductor die includes a voltage-controlled oscillator (VCO), wherein the VCO includes a resonant capacitor, and a resonant inductor coupled in parallel with the resonant capacitor. The resonant inductor includes a first elongated portion and a second elongated portion that are parallel with each other. The semiconductor die also includes a voltage supply line configured to route a supply voltage to the VCO, wherein the voltage supply line includes a first portion that runs parallel with the first and second elongated portions of the resonant inductor and is located between the first and second elongated portions of the resonant inductor.


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