The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Apr. 24, 2019
Applicants:

Denso Corporation, Kariya, Aichi-pref., JP;

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventors:

Masaru Miyazaki, Kariya, JP;

Tomohisa Sano, Kariya, JP;

Kentaro Hirose, Okazaki, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02M 7/00 (2006.01); H02M 3/158 (2006.01); H02M 1/32 (2007.01); H02M 7/5387 (2007.01);
U.S. Cl.
CPC ...
H02M 3/1588 (2013.01); H02M 3/1582 (2013.01); H02M 7/003 (2013.01); H02M 7/5387 (2013.01); H02M 2001/327 (2013.01); Y10T 29/53278 (2015.01);
Abstract

A power conversion device has semiconductor modules, a cooling unit, a capacitor module, a discharge resistance substrate, a control circuit substrate and a casing. The semiconductor modules from a power conversion circuit. The capacitor module is electrically connected to the semiconductor module. The discharge resistance is arranged on the discharge resistance substrate, and electrically discharges the capacitor module. The control circuit substrate controls operation of the semiconductor modules. The casing accommodates the semiconductor module, the cooling unit, the capacitor module, the discharge resistance substrate and the control circuit substrate. The discharge resistance substrate is arranged between an outer wall surface of the capacitor module and the control circuit substrate and arranged in a direction perpendicular to the control circuit substrate so that the discharge resistance substrate is separated in position from the outer wall surface of the capacitor module and the control circuit substrate.


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