The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Jun. 26, 2019
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Eiji Muramoto, Tokushima, JP;

Akinori Kishi, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/02 (2006.01); H01S 5/028 (2006.01); H01L 33/00 (2010.01); H01L 33/06 (2010.01); H01L 33/22 (2010.01); H01L 33/32 (2010.01); H01L 33/38 (2010.01); H01S 5/042 (2006.01); H01S 5/343 (2006.01); H01L 33/44 (2010.01);
U.S. Cl.
CPC ...
H01S 5/028 (2013.01); H01L 33/007 (2013.01); H01L 33/0095 (2013.01); H01L 33/06 (2013.01); H01L 33/22 (2013.01); H01L 33/32 (2013.01); H01L 33/38 (2013.01); H01L 33/44 (2013.01); H01S 5/0201 (2013.01); H01S 5/0425 (2013.01); H01S 5/34333 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01S 2304/04 (2013.01);
Abstract

A method for manufacturing a semiconductor element includes: providing a nitride semiconductor layer; performing plasma treatment to at least part of a surface of the nitride semiconductor layer in an oxygen-containing atmosphere while applying bias power; after the performing of the plasma treatment, heat treating the nitride semiconductor layer in an oxygen-containing atmosphere; forming a protective film on a region of the surface of the nitride semiconductor layer where the plasma treatment was performed; and forming an electrode in a region of the surface of the nitride semiconductor layer where the protective film was not formed.


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