The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Dec. 14, 2018
GM Global Technology Operations Llc, Detroit, MI (US);
Jonathan J. Lynch, Oxnard, CA (US);
GM Global Technology Operations LLC, Detroit, MI (US);
Abstract
A radio frequency (RF) antenna array for an RF printed circuit board (RF-PCB) having a PCB ground layer includes an interposer assembly, conductive pillars, and load element. The interposer assembly includes a substrate, a ground layer defining one or more apertures, a dielectric layer, and a microstrip trace. The substrate is spaced apart from the RF-PCB. The interposer ground layer is deposited onto the substrate. The dielectric layer is deposited onto the interposer ground layer. The microstrip trace, positioned on the dielectric layer, receives and directs incident RF energy along the longitudinal axis. The pillars electrically connect the ground layers and structurally support the substrate, such that RF energy along the trace couples to the upper surface of the interposer assembly through the aperture(s). The load element connects in series to the microstrip trace at a distal/terminal end of the array.