The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Jul. 26, 2016
Applicant:

Hon Hai Precision Industry Co., Ltd., New Taipei, TW;

Inventors:

Kohichi Tanaka, Osaka, JP;

Yozo Narutaki, Osaka, JP;

Katsuhiko Kishimoto, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 21/683 (2006.01); H01L 51/52 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0097 (2013.01); H01L 21/6835 (2013.01); H01L 51/003 (2013.01); H01L 51/5203 (2013.01); H01L 51/524 (2013.01); H05K 1/189 (2013.01); H01L 23/00 (2013.01); H01L 24/00 (2013.01); H01L 27/3241 (2013.01); H01L 2221/68331 (2013.01); H01L 2251/5338 (2013.01); H01L 2251/566 (2013.01); H01L 2924/12044 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A method for manufacturing flexible electronic devices is provided to enable to manufacture the flexible electronic devices without increasing a number of steps, enables to reuse a glass substrate, and reduces the possibility that the flexible electronic devices are damaged or corners of them are not bent even if the detached flexible electronic devices are brought into contact with each other. Electronic device structuresare formed on a resin film substrateformed on a glass substrate, and flexible electronic devices including the electronic device structuresformed on device formation areasare separated from the resin film substrateby irradiating first laser beamshaving a longer wavelength along a rectangular shape having rounded corners or chamfers at four corners to each the device formation areas, subsequently, an interface between the glass substrateand the resin film substrateis metamorphosed by irradiation of second laser beamshaving a shorter wavelength to entire surface of the resin film substratefrom a back side of the glass substrateso as to make the resin film substrateeasy to be peeled off from the glass substrate


Find Patent Forward Citations

Loading…