logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10749102 B1

PDFFull Text
Date of Patent:
Aug. 18, 2020

Filed:

Aug. 18, 2017

Piezoelectric vibration component and application method

Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Koji Nagahara, Nagaokakyo, JP;

Muneyuki Daidai, Nagaokakyo, JP;

Masahiro Saito, Nagaokakyo, JP;

Atsushi Sugimasa, Nagaokakyo, JP;

Hiroki Kitayama, Nagaokakyo, JP;

Shigehisa Yago, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:

Arent Fox LLP

Primary Examiner:

Thomas M Dougherty

Int. Cl.
CPC ...
H01L 41/09 (2006.01); B32B 7/12 (2006.01); H01B 1/22 (2006.01); H01L 41/313 (2013.01); H03H 9/10 (2006.01); H03H 3/02 (2006.01); H03H 9/05 (2006.01); H01L 41/08 (2006.01); H01L 41/047 (2006.01); H01L 41/053 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 41/313 (2013.01); H01L 24/29 (2013.01); H01L 41/0475 (2013.01); H01L 41/0478 (2013.01); H01L 41/053 (2013.01); H01L 41/0815 (2013.01); H03H 3/02 (2013.01); H03H 9/0509 (2013.01); H03H 9/10 (2013.01); H03H 9/1021 (2013.01); H01L 2224/2939 (2013.01); H01L 2224/29191 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29355 (2013.01); H01L 2924/0715 (2013.01);
Abstract

A piezoelectric vibration component that includes a piezoelectric vibrator, a substrate, and a conductive adhesive that bonds the piezoelectric vibrator to the substrate. The conductive adhesive contains a silicone-based base resin, a cross-linker, a conductive filler, and an insulating filler. The silicone-based base resin has a weight-average molecular weight of 20,000 to 102,000. The cross-linker has a number-average molecular weight of 1,950 to 4,620. The conductive filler and the insulating filler have a particle size of 10 μm or less.

Find Patent Forward Citations

Loading…