The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Aug. 01, 2018
Applicant:

Lg Innotek Co., Ltd., Seoul, KR;

Inventors:

Tae Sung Lee, Seoul, KR;

Won Jung Kim, Seoul, KR;

June O Song, Seoul, KR;

Chang Man Lim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/50 (2010.01); H01L 33/48 (2010.01); H01L 33/64 (2010.01); H01L 33/60 (2010.01); H01L 33/32 (2010.01); H01L 33/36 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 33/32 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 33/60 (2013.01); H01L 33/64 (2013.01); H01L 33/36 (2013.01);
Abstract

A light emitting device package according to an embodiment includes: a package body; a light emitting device disposed on the package body; and an adhesive disposed between the package body and the light emitting device. The package body includes first and second openings passing through the package body on an upper surface of the package body and a recess provided to concave in a direction of a lower surface of the package body from the upper surface of the package body. The light emitting device includes a first bonding part disposed on the first opening and a second bonding part disposed on the second opening. The adhesive is provided at the recess.


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