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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10749084 B1

PDFFull Text
Date of Patent:
Aug. 18, 2020

Filed:

Apr. 07, 2017

Optoelectronic component and method of producing an optoelectronic component

Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventor:

Thomas Reeswinkel, Regensburg, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:

DLA Piper LLP (US)

Primary Examiner:

Tan N Tran

Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 27/02 (2006.01); H01L 33/48 (2010.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 24/73 (2013.01); H01L 27/0248 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 25/167 (2013.01); H01L 33/486 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/181 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0091 (2013.01);
Abstract

An optoelectronic component includes a carrier having a chip mounting face, wherein the chip mounting face has a reflection coating, and an optoelectronic semiconductor chip adhesively bonded on the reflection coating by an adhesive so that the reflection coating is subdivided into a first subsection covered by the semiconductor chip and a second subsection, which is free of the semiconductor chip, wherein the adhesive has reflection particles that reflect electromagnetic radiation emitted by the semiconductor chip, and the second subsection is at least partially covered by a corrosion protection layer.

Find Patent Forward Citations

Reeswinkel, Thomas. (2020). Optoelectronic component and method of producing an optoelectronic component (U.S. Patent No. 10749084). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10749084

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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