The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Oct. 05, 2017
Applicant:

Osram Oled Gmbh, Regensburg, DE;

Inventors:

Dirk Becker, Langquaid, DE;

Matthias Sperl, Mintraching, DE;

Assignee:

OSRAM OLED GmbH, Regensburg, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/18 (2006.01); H01L 25/16 (2006.01); H01L 31/0232 (2014.01); H01L 31/0203 (2014.01); H01L 31/02 (2006.01); H01L 31/167 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 31/02327 (2013.01); H01L 25/167 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/0232 (2013.01); H01L 31/1876 (2013.01); H01L 31/167 (2013.01); H01L 33/62 (2013.01); Y02P 70/521 (2015.11);
Abstract

A method of producing sensors includes providing a carrier plate; arranging semiconductor chips on the carrier plate, wherein the semiconductor chips include at least radiation-detecting semiconductor chips; providing radiation-transmissive optical elements on the carrier plate provided with the semiconductor chips, wherein a plurality of radiation-transmissive optical elements are provided jointly on the carrier plate provided with the semiconductor chips; and singulating the carrier plate provided with the semiconductor chips and the radiation-transmissive optical elements, thereby forming separate sensors including a section of the carrier plate, at least one radiation-detecting semiconductor chip and at least one radiation-transmissive optical element.


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