The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Nov. 06, 2018
Applicant:
Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;
Inventors:
Karine Saxod, Les Marches, FR;
Jean-Michel Riviere, Froges, FR;
Assignee:
STMicroelectronics (Grenoble 2) SAS, Grenoble, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 25/16 (2006.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); H01L 31/02 (2006.01); H01L 31/167 (2006.01); H01L 33/48 (2010.01); H01L 33/58 (2010.01); H01L 33/62 (2010.01); H01L 33/00 (2010.01); B29C 45/14 (2006.01); B29C 69/00 (2006.01); H01L 31/18 (2006.01); G01S 7/481 (2006.01); B29L 31/34 (2006.01); G01S 17/04 (2020.01);
U.S. Cl.
CPC ...
H01L 25/165 (2013.01); B29C 45/14336 (2013.01); B29C 45/14639 (2013.01); B29C 45/14754 (2013.01); B29C 69/001 (2013.01); G01S 7/4813 (2013.01); H01L 25/167 (2013.01); H01L 31/0203 (2013.01); H01L 31/02005 (2013.01); H01L 31/02325 (2013.01); H01L 31/167 (2013.01); H01L 31/18 (2013.01); H01L 33/005 (2013.01); H01L 33/483 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); B29C 45/14065 (2013.01); B29C 2045/1477 (2013.01); B29C 2793/00 (2013.01); B29C 2793/009 (2013.01); B29L 2031/3481 (2013.01); G01S 17/04 (2020.01); H01L 2933/0058 (2013.01);
Abstract
An encapsulation cover for an electronic package includes a cover body having a frontal wall provided with at least one optical element allowing light to pass through. The optical element is inserted into the encapsulation cover by overmolding into a through-passage of the frontal wall. A front face of the optical element is set back with respect to a front face of the frontal wall. The process for fabricating the encapsulation cover includes forming a stack of a sacrificial spacer on top of an optical element, with the stack placed into a cavity of a mold.