The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Jan. 04, 2012
Applicants:

Ryan B. Wicker, El Paso, TX (US);

Eric Macdonald, El Paso, TX (US);

Francisco Medina, El Paso, TX (US);

David Espalin, El Paso, TX (US);

Danny W. Muse, El Paso, TX (US);

Inventors:

Ryan B. Wicker, El Paso, TX (US);

Eric MacDonald, El Paso, TX (US);

Francisco Medina, El Paso, TX (US);

David Espalin, El Paso, TX (US);

Danny W. Muse, El Paso, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/30 (2006.01); H05K 3/46 (2006.01); H01L 21/02 (2006.01); H01L 23/00 (2006.01); B33Y 10/00 (2015.01); B33Y 70/00 (2020.01); B33Y 80/00 (2015.01); B29C 70/72 (2006.01); H05K 1/18 (2006.01); H01L 21/48 (2006.01); B29C 64/106 (2017.01); H05K 3/40 (2006.01); H05K 1/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/76 (2013.01); B29C 64/106 (2017.08); B29C 70/72 (2013.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); H01L 21/4846 (2013.01); H01L 24/82 (2013.01); H05K 1/183 (2013.01); H05K 1/186 (2013.01); H05K 3/4664 (2013.01); B29C 2793/00 (2013.01); H01L 21/486 (2013.01); H01L 24/24 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/75 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/7525 (2013.01); H01L 2224/7528 (2013.01); H01L 2224/7565 (2013.01); H01L 2224/75264 (2013.01); H01L 2224/75901 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1301 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/157 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/15788 (2013.01); H05K 1/0272 (2013.01); H05K 3/0044 (2013.01); H05K 3/4069 (2013.01); H05K 2203/0228 (2013.01); H05K 2203/122 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/53174 (2015.01);
Abstract

The present invention provides a system and method for making a three-dimensional electronic, electromagnetic or electromechanical component/device by: (1) creating one or more layers of a three-dimensional substrate by depositing a substrate material in a layer-by-layer fashion, wherein the substrate includes a plurality of interconnection cavities and component cavities; (2) filling the interconnection cavities with a conductive material; and (3) placing one or more components in the component cavities.


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