The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Nov. 20, 2019
Applicant:

Lite-on Singapore Pte. Ltd., Singapore, SG;

Inventor:

You-Fa Wang, Singapore, SG;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 21/4842 (2013.01); H01L 23/49541 (2013.01); H01L 23/49551 (2013.01); H01L 23/66 (2013.01); H01L 24/49 (2013.01); H01L 2223/6661 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48151 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/14 (2013.01);
Abstract

The present invention provides a leadframe component and a package structure. The leadframe component includes a first leadframe and a second leadframe. The first leadframe includes a first chip-mounting portion for carrying a first chip, a first coil portion, a plurality of first pins and a plurality of first floated pins. The second leadframe includes a second chip-mounting portion for carrying a second chip, a second coil portion, a plurality of second pins and a plurality of second floated pins. The first leadframe is disposed above or under the second leadframe for aligning the first coil portion with the second coil portion.


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