The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Jan. 24, 2019
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Atsushi Ohoka, Kyoto, JP;

Nobuyuki Horikawa, Kyoto, JP;

Masao Uchida, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/482 (2006.01); H01L 29/78 (2006.01); H01L 29/06 (2006.01); H01L 29/16 (2006.01); H01L 29/423 (2006.01); H01L 29/417 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4824 (2013.01); H01L 29/0696 (2013.01); H01L 29/1608 (2013.01); H01L 29/4238 (2013.01); H01L 29/7811 (2013.01); H01L 29/7828 (2013.01); H01L 29/0619 (2013.01); H01L 29/41766 (2013.01);
Abstract

A silicon carbide semiconductor device includes an upper gate electrode including a gate pad and a gate wiring line, and an upper source electrode including first and second source pads. The gate wiring line includes a gate global wiring line extending to encircle the source pads, and a gate connection wiring line. The upper source electrode includes an outer periphery source wiring line extending to encircle the gate global wiring line, and first and second source connections connecting the outer periphery source wiring line to the first and second source pads, respectively. The gate global wiring line includes a first portion, a second portion, and a third portion. The first portion is split at a first substrate corner and a second substrate corner and lies between the first substrate corner and the second substrate corner.


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