The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Feb. 20, 2017
Applicant:
Fujikura Ltd., Tokyo, JP;
Inventor:
Yoshikazu Kaifuchi, Sakura, JP;
Assignee:
FUJIKURA LTD., Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01S 5/022 (2006.01); H01L 23/40 (2006.01); H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/042 (2006.01); B23K 1/00 (2006.01); H01L 23/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/40 (2013.01); B23K 1/0008 (2013.01); H01L 23/36 (2013.01); H01S 5/022 (2013.01); H01S 5/024 (2013.01); H01S 5/0261 (2013.01); H01S 5/02236 (2013.01); H01S 5/02272 (2013.01); H01S 5/02276 (2013.01); H01S 5/02469 (2013.01); H01S 5/02476 (2013.01); H01S 5/02484 (2013.01); H01S 5/0425 (2013.01);
Abstract
The semiconductor laser modulehas an electrically conductive heat sinka submountdisposed above the heat sinka semiconductor laser devicedisposed above the submounta lower solder layerdisposed between the heat sinkand the submountand an upper solder layerelectrically connected to the semiconductor laser deviceand the heat sinkThis upper solder layerhas an electric resistivity lower than an electric resistivity of the submountand extends along surfacesandof the submountto the heat sink