The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Apr. 22, 2019
Applicant:

Rohm Co., Ltd., Kyoto-shi, Kyoto, JP;

Inventor:

Seita Iwahashi, Kyoto, JP;

Assignee:

ROHM CO., LTD., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 23/31 (2006.01); H01L 23/12 (2006.01); H01L 23/29 (2006.01); H01L 23/36 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/18 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H02M 7/00 (2006.01); H02M 7/537 (2006.01); H02P 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3107 (2013.01); H01L 23/12 (2013.01); H01L 23/18 (2013.01); H01L 23/29 (2013.01); H01L 23/36 (2013.01); H01L 23/367 (2013.01); H01L 23/49838 (2013.01); H01L 25/07 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8592 (2013.01); H02P 27/06 (2013.01);
Abstract

The power module includes: a first metallic pattern; a plurality of power devices bonded on the first metallic pattern, each of the plurality of the power devices has a thickness thinner than a thickness of the metallic pattern; a frame member disposed so as to collectively enclose a predetermined number of the power devices on the first metallic pattern; a second metallic pattern disposed outside the frame member; and a resin layer configured to seal the plurality of the power devices and the first and second metallic patterns so as to include the frame member, wherein the frame member suppresses a stress according to a difference between a coefficient of thermal expansion of the metallic pattern and a coefficient of thermal expansion of the power devices. There is provided the power module easy to be fabricated, capable of suppressing the degradation of the bonded portion and improving reliability.


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