The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Jan. 12, 2017
Applicant:
Uniqarta, Inc., Cambridge, MA (US);
Inventors:
Val Marinov, Fargo, ND (US);
Yuriy Atanasov, Sofia, BG;
Assignee:
Uniqarta, Inc., Cambridge, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); B32B 37/26 (2006.01); H01L 21/67 (2006.01); B32B 38/00 (2006.01); H01L 23/00 (2006.01); B32B 37/00 (2006.01); H01L 21/304 (2006.01); H01L 21/3065 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); B32B 38/18 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 37/025 (2013.01); B32B 37/26 (2013.01); B32B 38/0004 (2013.01); H01L 21/304 (2013.01); H01L 21/3065 (2013.01); H01L 21/4853 (2013.01); H01L 21/67092 (2013.01); H01L 21/67132 (2013.01); H01L 21/67144 (2013.01); H01L 21/78 (2013.01); H01L 24/75 (2013.01); H01L 24/83 (2013.01); B32B 2038/1891 (2013.01); B32B 2307/412 (2013.01); B32B 2309/105 (2013.01); B32B 2310/0831 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68354 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/294 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29301 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/75252 (2013.01); H01L 2224/75261 (2013.01); H01L 2224/75745 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/83874 (2013.01); H01L 2924/14 (2013.01);
Abstract
A method includes dicing a wafer to form discrete components; transferring the discrete components onto a transparent carrier, including adhering the discrete component to a carrier release layer on the transparent carrier; and releasing one of the discrete components from the transparent carrier, the one of the discrete components being deposited onto a device substrate after the releasing.