The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Mar. 29, 2018
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Gunther Mackh, Neumarkt, DE;

Markus Brunnbauer, Lappersdorf, DE;

Adolf Koller, Regensburg, DE;

Jochen Mueller, Regensburg, DE;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 29/36 (2006.01); H01L 21/268 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/268 (2013.01); H01L 21/6836 (2013.01); H01L 29/36 (2013.01); H01L 21/78 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68336 (2013.01); H01L 2221/68381 (2013.01);
Abstract

According to various embodiments, a method for processing a carrier may include: forming an arrangement of defects in the carrier, wherein a surface region of the carrier is disposed over the arrangement of defects at a first surface of the carrier, wherein the arrangement of defects is configured to generate a crack structure extending from the arrangement of defects into the surface region; partially removing the carrier to remove the arrangement of defects; and separating the surface region of the carrier into a plurality of surface region portions along the crack structure.


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