The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Oct. 26, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Carsten von Koblinski, Bodensdorf, AT;
Ulrike Fastner, Villach, AT;
Andre Brockmeier, Villach, AT;
Peter Zorn, Villach, AT;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/52 (2006.01); H01L 21/78 (2006.01); H01L 21/683 (2006.01); H01L 23/051 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 21/52 (2013.01); H01L 21/4803 (2013.01); H01L 21/683 (2013.01); H01L 21/78 (2013.01); H01L 23/051 (2013.01); H01L 23/492 (2013.01); H01L 23/49861 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 23/3677 (2013.01); H01L 2224/0346 (2013.01); H01L 2224/2101 (2013.01); H01L 2224/214 (2013.01); H01L 2224/215 (2013.01); H01L 2224/221 (2013.01); H01L 2224/2732 (2013.01); H01L 2224/29011 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29188 (2013.01); H01L 2224/32105 (2013.01); H01L 2224/32111 (2013.01); H01L 2224/32155 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82101 (2013.01); H01L 2224/82105 (2013.01); H01L 2224/82947 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/15156 (2013.01); H01L 2924/3511 (2013.01);
Abstract
A semiconductor device includes an insulating carrier structure comprised of an insulating inorganic material. The carrier structure has a receptacle in which a semiconductor chip is disposed. The semiconductor chip has a first side, a second side and a lateral rim. The carrier structure laterally surrounds the semiconductor chip and the lateral rim. The semiconductor device also includes a metal structure on and in contact with the second side of the semiconductor chip and embedded in the carrier structure.