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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10748761 B1

PDFFull Text
Date of Patent:
Aug. 18, 2020

Filed:

Mar. 01, 2019

Semiconductor manufacturing apparatus and method for manufacturing semiconductor device

Applicant:

Toshiba Memory Corporation, Minato-ku, Tokyo, JP;

Inventors:

Akitsugu Hatazaki, Yokkaichi Mie, JP;

Kotaro Nomura, Yokkaichi Mie, JP;

Assignee:

TOSHIBA MEMORY CORPORATION, Tokyo, JP;

Attorney:

Foley & Lardner LLP

Primary Examiner:

Nikolay K Yushin

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 29/00 (2006.01); H01L 21/02 (2006.01); H01L 29/78 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02348 (2013.01); H01L 21/0217 (2013.01); H01L 21/0228 (2013.01); H01L 21/02164 (2013.01); H01L 21/67115 (2013.01); H01L 29/7843 (2013.01);
Abstract

A semiconductor manufacturing apparatus includes at least one UV lamp provided at a position facing a surface of a semiconductor substrate arranged to irradiate the surface of the semiconductor substrate with UV light, and a shutter disposed between the surface of the semiconductor substrate and the at least one UV lamp and configured to block UV light emitted by the UV lamp. The shutter includes a first movable part movable in a first direction being an in-plane direction parallel to the semiconductor substrate, and a second movable part movable in a second direction being an in-plane direction perpendicular to the first direction, the second movable part being movable independently of the first movable part.

Find Patent Forward Citations

Hatazaki, Akitsugu. (2020). Semiconductor manufacturing apparatus and method for manufacturing semiconductor device (U.S. Patent No. 10748761). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10748761

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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