The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Jan. 24, 2014
Hitachi High-tech Corporation, Minato-ku, Tokyo, JP;
Hiroyuki Ando, Tokyo, JP;
Yuta Asaga, Tokyo, JP;
Hitachi High-Tech Corporation, Tokyo, JP;
Abstract
In order to specify a dust emitting mechanism portion, a wafer must be provided near a mechanism portion in operation and the mechanism portion must be operated so that foreign matter sticks to a surface of the wafer. A mechanism that allows foreign matter to stick to a wafer by repeating operation of each of particular portions in a device and thus intentionally bringing about dust emission is provided. For example, the device includes a control device, a sample chamber in which a sample is processed, and a mechanism that loads and unloads a sample to and from the sample chamber, the mechanism has a plurality of portions, the control device has a script, and a particular portion of the plurality of portions of the mechanism is repeatedly operated as the control device executes the script.