The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Sep. 11, 2018
Applicant:

SK Hynix Inc., Gyeonggi-do, KR;

Inventors:

Ji-Hwan Kim, Seoul, KR;

Heat-Bit Park, Gyeonggi-do, KR;

Assignee:

SK hynix Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/10 (2006.01); G11C 11/4096 (2006.01); G11C 5/06 (2006.01); G11C 29/36 (2006.01); G11C 29/02 (2006.01); G11C 5/02 (2006.01); G11C 29/12 (2006.01);
U.S. Cl.
CPC ...
G11C 11/4096 (2013.01); G11C 5/02 (2013.01); G11C 5/06 (2013.01); G11C 7/106 (2013.01); G11C 7/1006 (2013.01); G11C 7/1066 (2013.01); G11C 29/022 (2013.01); G11C 29/36 (2013.01); G11C 29/023 (2013.01); G11C 29/1201 (2013.01); G11C 29/12015 (2013.01);
Abstract

An integrated circuit chip includes: one or more couplers suitable for transferring data between stacked chips; one or more data nodes suitable for transferring data to a host; and one or more transfer circuits on a transfer path for transferring data between the one or more couplers and the one or more data nodes, wherein at least one transfer circuit among the one or more transfer circuits inverts a portion of the data which is transferred by the at least one transfer circuit.


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Kim, Ji-Hwan. (2020). Integrated circuit chip (U.S. Patent No. 10748601). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10748601

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