The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Aug. 22, 2018
Boe Technology Group Co., Ltd., Beijing, CN;
Chongqing Boe Optoelectronics Technology Co., Ltd., Chongqing, CN;
Qining Mao, Beijing, CN;
Jian Xu, Beijing, CN;
Yang Wang, Beijing, CN;
Chao Xu, Beijing, CN;
Changqing Huang, Beijing, CN;
Zhanghai Hou, Beijing, CN;
Pengcheng Niu, Beijing, CN;
Peng Liu, Beijing, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
CHONGQING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., Chongqing, CN;
Abstract
The present disclosure provides a conductive agent and a module bonding method. In the method, a conductive agent is sprayed to a bonding region. The conductive agent comprising a liquid ultraviolet curable adhesive and conductive particles dispersed in the ultraviolet curable adhesive. A module layer is pre-pressed onto the bonding region with the conductive agent between the module layer and the bonding region. The conductive agent is cured by irradiating the conductive agent with ultraviolet rays and pressurizing the conductive agent, so that the module layer is electrically connected and bonded to the bonding region.