The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Dec. 05, 2019
Applicant:

Magic Leap, Inc., Plantation, FL (US);

Inventors:

Shuqiang Yang, Austin, TX (US);

Vikramjit Singh, Pflugerville, TX (US);

Kang Luo, Austin, TX (US);

Nai-Wen Pi, Plano, TX (US);

Frank Y. Xu, Austin, TX (US);

Assignee:

Magic Leap, Inc., Plantation, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 27/42 (2006.01); G02B 5/18 (2006.01); G02B 27/01 (2006.01); G02B 27/00 (2006.01);
U.S. Cl.
CPC ...
G02B 27/4255 (2013.01); G02B 5/1814 (2013.01); G02B 27/0081 (2013.01); G02B 27/0172 (2013.01); G02B 27/4272 (2013.01); G02B 2027/0125 (2013.01); G02B 2027/0174 (2013.01);
Abstract

A method of depositing a variable thickness material includes providing a substrate and providing a shadow mask having a first region with a first aperture dimension to aperture periodicity ratio and a second region with a second aperture dimension to aperture periodicity ratio less than the first aperture dimension to aperture periodicity ratio. The method also includes positioning the shadow mask adjacent the substrate and performing a plasma deposition process on the substrate to deposit the variable thickness material. A layer thickness adjacent the first region is greater than a layer thickness adjacent the second region.


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