The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Sep. 23, 2016
Applicant:

Weihai Hualing Opto-electronics Co., Ltd., Shandong, CN;

Inventor:

Wuchang Qi, Shandong, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 27/08 (2006.01); G01B 7/06 (2006.01); G01B 7/14 (2006.01); G01B 7/02 (2006.01); G01B 7/00 (2006.01); G01B 21/08 (2006.01); G07D 7/164 (2016.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
G01B 7/06 (2013.01); G01B 7/003 (2013.01); G01B 7/023 (2013.01); G01B 7/105 (2013.01); G01B 7/14 (2013.01); G01B 21/08 (2013.01); G07D 7/164 (2013.01); H01L 22/12 (2013.01); H01L 22/34 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Disclosed is a film thickness detection device, including a common unit () and a detection unit (); the common unit () comprises at least one common electrode (); the detection unit () comprises at least one sensor chip () and a signal processing unit (); the sensor chips () are opposite to the common unit () in a first direction and are arranged at intervals; the spaces between the common unit () and the sensor chips () form a transport channel for a to-be-tested film; each of the sensor chips () comprises at least one row of multiple detection electrodes () arranged along a second direction; the second direction is perpendicular to a moving direction of the to-be-tested film; the first direction is perpendicular to a first plane; the first plane is parallel to the second direction; the sensor chips () are configured to induce electrical signals on the common electrodes () and output the electrical signals; and the signal processing unit () is electrically connected with the sensor chips (), processes the electrical signals output by the sensor chips () and outputs the electrical signals.


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