The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Sep. 04, 2015
Applicant:

Diamet Corporation, Niigata-shi, JP;

Inventors:

Yoshinari Ishii, Niigata, JP;

Shinichi Takezoe, Niigata, JP;

Tsuneo Maruyama, Niigata, JP;

Assignee:

Diamet Corporation, Niigata-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/06 (2006.01); B22F 3/10 (2006.01); B22F 3/16 (2006.01); B22F 5/00 (2006.01); B22F 5/10 (2006.01); C22C 1/04 (2006.01); B22F 1/00 (2006.01); B22F 3/02 (2006.01); F16C 33/12 (2006.01); F16C 33/14 (2006.01);
U.S. Cl.
CPC ...
C22C 9/06 (2013.01); B22F 1/00 (2013.01); B22F 3/02 (2013.01); B22F 3/10 (2013.01); B22F 3/16 (2013.01); B22F 5/00 (2013.01); B22F 5/106 (2013.01); C22C 1/0425 (2013.01); F16C 33/121 (2013.01); F16C 33/128 (2013.01); F16C 33/145 (2013.01); B22F 2301/10 (2013.01); B22F 2998/10 (2013.01); F16C 2204/10 (2013.01);
Abstract

Provided is a Cu-based sintered bearing comprising: 15-36 mass % of Ni; 3-13 mass % of Sn; 0.05-0.55 mass % of P; and 0.02-4 mass % of C in total, the balance consisting of Cu and inevitable impurities, wherein the content of C forming an alloy with a matrix within Cu—Ni-based main phase grains is 0.02-0.10 mass %.


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