The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Apr. 07, 2017
Applicant:

Kaneka Corporation, Osaka, JP;

Inventors:

Yasutaka Kondo, Otsu, JP;

Hiroyuki Ushiro, Settsu, JP;

Shoto Banya, Otsu, JP;

Makoto Tawada, Settsu, JP;

Assignee:

KANEKA CORPORATION, Osaka-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 73/10 (2006.01); C08J 5/18 (2006.01); B32B 27/28 (2006.01); C08L 79/08 (2006.01);
U.S. Cl.
CPC ...
C08G 73/1064 (2013.01); C08G 73/1039 (2013.01); C08G 73/1042 (2013.01); C08G 73/1078 (2013.01); C08J 5/18 (2013.01); B32B 27/281 (2013.01); B32B 2307/412 (2013.01); B32B 2307/536 (2013.01); B32B 2457/20 (2013.01); C08J 2379/08 (2013.01); C08L 79/08 (2013.01); C08L 2203/16 (2013.01);
Abstract

A polyimide resin of the present invention contains at least one kind of an alicyclic acid dianhydride as an acid dianhydride component and contains at least one kind of a sulfonyl group-containing diamine as a diamine component. A film containing the polyimide resin of the present invention preferably has a yellowness of 3.0 or less, a tensile elastic modulus of 3.5 GPa or more, a pencil hardness of 4H or more, and a light transmittance of 60% or more at a wavelength of 400 nm. The polyimide resin of the present invention and the film of the present invention preferably have a glass transition temperature of 300° C. or higher.


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