The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 2020

Filed:

Nov. 20, 2017
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Lu Liu, Beijing, CN;

Weifeng Zhou, Beijing, CN;

Shanchen Kao, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/26 (2006.01); B32B 38/10 (2006.01); H01L 51/00 (2006.01); G02F 1/1333 (2006.01); H01L 27/32 (2006.01);
U.S. Cl.
CPC ...
B32B 3/266 (2013.01); B32B 38/10 (2013.01); H01L 51/0097 (2013.01); B32B 2309/105 (2013.01); B32B 2310/0843 (2013.01); B32B 2457/20 (2013.01); G02F 1/133305 (2013.01); H01L 27/3241 (2013.01);
Abstract

The present disclosure proposes a method for manufacturing an electronic apparatus and a corresponding electronic apparatus. The method comprises: removing a back film in a first region of a flexible substrate; and bending the flexible substrate in the first region to form an electronic apparatus having a bending portion. The electronic apparatus comprises: a flexible substrate having a bending portion in a first region thereof; and a back film bonded to a region of a back surface of the flexible substrate except for the first region.


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