The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 2020
Filed:
Apr. 18, 2017
Metal plate for laser processing and method for producing stainless steel plate for laser processing
Applicant:
Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;
Inventors:
Assignee:
NIPPON STEEL CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/40 (2014.01); C21D 9/46 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/48 (2006.01); C21D 8/02 (2006.01); C21D 1/30 (2006.01); C22C 14/00 (2006.01); C22F 1/18 (2006.01); C22C 38/40 (2006.01); C22C 38/38 (2006.01); C22C 38/58 (2006.01); C22C 38/18 (2006.01); C21D 1/28 (2006.01); B23K 3/06 (2006.01); B23K 26/384 (2014.01); B23K 26/14 (2014.01); B23K 1/00 (2006.01); B05C 21/00 (2006.01); B21B 1/26 (2006.01); B23K 3/08 (2006.01); B23K 26/382 (2014.01); B21B 1/38 (2006.01); B23K 101/42 (2006.01); B23K 103/04 (2006.01); B23K 103/14 (2006.01); B23K 101/18 (2006.01); B23K 103/10 (2006.01); B23K 103/18 (2006.01);
U.S. Cl.
CPC ...
B23K 26/40 (2013.01); B05C 21/005 (2013.01); B21B 1/26 (2013.01); B21B 1/38 (2013.01); B23K 1/0016 (2013.01); B23K 3/0638 (2013.01); B23K 3/08 (2013.01); B23K 26/14 (2013.01); B23K 26/382 (2015.10); B23K 26/384 (2015.10); C21D 1/28 (2013.01); C21D 1/30 (2013.01); C21D 8/0226 (2013.01); C21D 8/0236 (2013.01); C21D 8/0247 (2013.01); C21D 8/0273 (2013.01); C21D 9/46 (2013.01); C22C 14/00 (2013.01); C22C 38/001 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/18 (2013.01); C22C 38/38 (2013.01); C22C 38/40 (2013.01); C22C 38/48 (2013.01); C22C 38/58 (2013.01); C22F 1/183 (2013.01); B21B 2001/386 (2013.01); B23K 2101/18 (2018.08); B23K 2101/42 (2018.08); B23K 2103/05 (2018.08); B23K 2103/10 (2018.08); B23K 2103/14 (2018.08); B23K 2103/26 (2018.08); C21D 2211/001 (2013.01); C21D 2211/005 (2013.01); C21D 2261/00 (2013.01); C22C 38/002 (2013.01); Y10T 428/12 (2015.01); Y10T 428/12361 (2015.01);
Abstract
A metal plate for laser processing (such as a stainless steel plate or a titanium plate) and preferably an austenitic stainless steel plate suitable for use as a metal mask or the like which undergoes fine processing with a laser has an average grain diameter d (μm) and a plate thickness t (μm) which satisfy the equation d≤0.0448·t−1.28.