The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Jul. 30, 2019
Applicant:

Microcosm Technology Co., Ltd, Tainan, TW;

Inventor:

Tang-Chieh Huang, Tainan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 3/10 (2006.01); H01L 23/00 (2006.01); H01L 31/04 (2014.01); H01L 31/18 (2006.01); H05K 3/02 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/38 (2006.01); H05K 3/24 (2006.01); H05K 3/06 (2006.01);
U.S. Cl.
CPC ...
H05K 3/022 (2013.01); H05K 1/028 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); H05K 1/092 (2013.01); H05K 3/38 (2013.01); H05K 3/027 (2013.01); H05K 3/06 (2013.01); H05K 3/241 (2013.01); H05K 2203/0723 (2013.01);
Abstract

The present invention provides a thinned flexible polyimide substrate and a method for manufacturing the same. The thinned flexible polyimide substrate comprises a polyimide resin, a conductor layer, and a polyimide insulating layer. The polyimide resin has a linear thermal expansion coefficient of less than 40 ppm/K. The conductor layer is formed of a plurality of stacked metal nanoparticles having pores therebetween, and each of the pores has a size between 0.1 μm and 1 μm. A portion of the polyimide resin fills into the pores. The polyimide insulating layer is formed of the polyimide resin coated on the conductor layer.


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