The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Jun. 28, 2019
Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, Anhui, CN;
Boe Technology Group Co., Ltd., Beijing, CN;
Enming Xie, Beijing, CN;
Xiaolong Wei, Beijing, CN;
Chun Cao, Beijing, CN;
Wenchao Bao, Beijing, CN;
HEFEI XINSHENG OPTOELECTRONICS TECHNOLOGY CO., LTD., Hefei, Anhui, CN;
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Abstract
The present disclosure provides a printed circuit board including a plurality of conductive layers separated by insulating medium and a plurality of connection structures. Each connection structure penetrates each of the conductive layers. The plurality of conductive layers comprises a first conductive layer in which first signal lines are located and a second conductive layer in which second signal lines are located, and the first and second signal lines are connected via the connection structures. Anti-pads surrounding the connection structures are provided on others of the plurality of conductive layers except the first and the second conductive layers. For a same connection structure, the anti-pads surrounding the connection structure include adjacent anti-pads and nonadjacent anti-pads. Size of the adjacent anti-pads in any direction parallel to the conductive layers is smaller than that of the nonadjacent anti-pads. The present disclosure also provides a display apparatus.