The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Mar. 07, 2018
Applicant:
Ls Mtron Ltd., Anyang-si, Gyeonggi-do, KR;
Inventors:
Seung Min Kim, Anyang-si, KR;
Shan Hua Jin, Anyang-si, KR;
Assignee:
KCF TECHNOLOGIES CO., LTD, Anyang-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/66 (2006.01); H01M 4/133 (2010.01); C25D 3/38 (2006.01); C25D 7/06 (2006.01); C25D 1/04 (2006.01); C23C 22/37 (2006.01); C25D 5/04 (2006.01); C25D 5/48 (2006.01); C25D 1/20 (2006.01); H01M 4/13 (2010.01); H01M 4/587 (2010.01); H01M 4/48 (2010.01); H01M 4/02 (2006.01); H01M 10/0525 (2010.01); H01M 4/36 (2006.01);
U.S. Cl.
CPC ...
H01M 4/667 (2013.01); C23C 22/37 (2013.01); C25D 1/04 (2013.01); C25D 1/20 (2013.01); C25D 3/38 (2013.01); C25D 5/04 (2013.01); C25D 5/48 (2013.01); C25D 7/0642 (2013.01); H01M 4/133 (2013.01); H01M 4/661 (2013.01); C23C 2222/20 (2013.01); H01M 4/13 (2013.01); H01M 4/364 (2013.01); H01M 4/483 (2013.01); H01M 4/587 (2013.01); H01M 10/0525 (2013.01); H01M 2004/027 (2013.01);
Abstract
Provided is a copper foil. The copper foil includes a copper layer and a protective layer disposed on the copper layer, wherein a surface of the protective layer has a maximum height roughness (R) of 0.6 μm to 3.5 μm, a peak density (PD) of 5 to 110, and an oxygen atomic amount of 22 at % (atomic %) to 67 at %.