The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Jan. 10, 2019
Applicant:

Shanghai Tianma Micro-electronics Co., Ltd., Shanghai, CN;

Inventors:

Zeshang He, Shanghai, CN;

Liang Xing, Shanghai, CN;

Jujian Fu, Shanghai, CN;

Gang Liu, Shanghai, CN;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); H01L 33/36 (2010.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/83 (2013.01); H01L 24/95 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/36 (2013.01); H01L 33/0095 (2013.01); H01L 2224/8322 (2013.01); H01L 2224/83234 (2013.01); H01L 2224/83871 (2013.01); H01L 2224/95001 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A Micro LED transferring method, a Micro LED display panel and a Micro LED display device are provided. The Micro LED display panel includes a substrate, a pixel defining layer including multiple openings, first conducting layer located in the multiple openings, photosensitive conductive bonding layers and Micro LED structures. The photosensitive conductive bonding layer is solidified after receiving light, such that elements adhered on two opposite surfaces of the photosensitive conductive bonding layer are bonded together. Due to the photosensitive conductive bonding layer, a Micro LED is detected during a transferring process rather than after a bonding process, thereby eliminating a step of removing a bonded abnormal Micro LED, thus simplifying the detecting and repairing processes of Micro LEDs.


Find Patent Forward Citations

Loading…