The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Aug. 12, 2013
Lumileds Llc, San Jose, CA (US);
Quanbo Zou, Eindhoven, NL;
Salman Akram, Eindhoven, NL;
Jerome Chandra Bhat, Eindhoven, NL;
Minh Ngoc Trieu, Eindhoven, NL;
Robert Blank, Eindhoven, NL;
LUMILEDS, LLC, San Jose, CA (US);
Abstract
In one embodiment, a semiconductor device wafer () contains electrical components and has electrodes () on a first side of the device wafer (). A transparent carrier wafer () is bonded to the first side of the device wafer () using a bonding material () (e.g., a polymer or metal). The second side of the device wafer () is then processed, such as thinned, while the carrier wafer () provides mechanical support for the device wafer (). The carrier wafer () is then de-bonded from the device wafer () by passing a laser beam () through the carrier wafer (), the carrier wafer () being substantially transparent to the wavelength of the beam. The beam impinges on the bonding material (), which absorbs the beam's energy, to break the chemical bonds between the bonding material () and the carrier wafer (). The released carrier wafer () is then removed from the device wafer (), and the residual bonding material is cleaned from the device wafer ().