The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

May. 24, 2018
Applicant:

North Carolina State University, Raleigh, NC (US);

Inventors:

Edward Sachet, Raleigh, NC (US);

Christopher Shelton, Raleigh, NC (US);

Jon-Paul Maria, Raleigh, NC (US);

Kyle Patrick Kelley, Lake Lure, NC (US);

Evan Lars Runnerstrom, Durham, NC (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/267 (2006.01); C23C 14/08 (2006.01); H01L 21/02 (2006.01); H01L 21/477 (2006.01); C23C 14/35 (2006.01); C23C 14/54 (2006.01); C23C 14/34 (2006.01); C23C 14/00 (2006.01); H01L 31/0224 (2006.01); H01L 29/45 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 29/267 (2013.01); C23C 14/0042 (2013.01); C23C 14/0057 (2013.01); C23C 14/086 (2013.01); C23C 14/345 (2013.01); C23C 14/3485 (2013.01); C23C 14/35 (2013.01); C23C 14/352 (2013.01); C23C 14/548 (2013.01); H01L 21/02266 (2013.01); H01L 21/477 (2013.01); H01L 29/45 (2013.01); H01L 29/458 (2013.01); H01L 31/022466 (2013.01); H01L 29/7869 (2013.01);
Abstract

A method of forming a metal oxide includes providing a reactive deposition atmosphere having an oxygen concentration of greater than about 20 percent in a chamber including a substrate therein. A pulsed DC signal is applied to a sputtering target comprising a metal, to sputter metal particles therefrom. A doping element may be supplied from a doping source (such as an alloyed metal target) in the reaction chamber. An electrically conductive metal oxide film comprising an oxide of the metal is deposited on the substrate responsive to a reaction between the metal particles and the reactive deposition atmosphere. Related devices are also discussed.


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