The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Nov. 22, 2016
Applicant:

Delta Electronics, Inc., Taoyuan, TW;

Inventors:

Shiau-Shi Lin, Taoyuan, TW;

Tzu-Hsuan Cheng, Taoyuan, TW;

Hsin-Chang Tsai, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/08 (2006.01); H01L 23/522 (2006.01); H01L 29/66 (2006.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0891 (2013.01); H01L 23/5226 (2013.01); H01L 29/66856 (2013.01); H01L 29/66863 (2013.01); H01L 29/66962 (2013.01); H01L 23/3121 (2013.01); H01L 23/367 (2013.01); H01L 2224/16245 (2013.01); H01L 2924/13063 (2013.01);
Abstract

A semiconductor device is provided. The semiconductor device includes a substrate; an active layer disposed on the substrate; a via through the active layer; and a plurality of electrodes disposed on the active layer and into the via. Additionally, a package structure that includes the semiconductor device is also provided. The electrode is electrically connected to the substrate through the via.


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