The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 2020
Filed:
Oct. 14, 2015
Applicant:
Ams Sensors Singapore Pte. Ltd., Singapore, SG;
Inventors:
Assignee:
ams Sensors Singapore Pte. Ltd., Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/32 (2006.01); H01L 31/0232 (2014.01); G02B 5/18 (2006.01); B32B 33/00 (2006.01); B32B 37/02 (2006.01); H01L 23/00 (2006.01); B32B 37/12 (2006.01); G02B 27/09 (2006.01); G02B 27/42 (2006.01); H01S 5/00 (2006.01); B32B 37/24 (2006.01); G02B 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 27/3209 (2013.01); B32B 33/00 (2013.01); B32B 37/02 (2013.01); B32B 37/1292 (2013.01); G02B 5/1847 (2013.01); G02B 5/1866 (2013.01); G02B 27/0944 (2013.01); G02B 27/0977 (2013.01); G02B 27/4205 (2013.01); H01L 24/94 (2013.01); H01L 31/0232 (2013.01); B32B 2037/243 (2013.01); B32B 2307/412 (2013.01); B32B 2307/418 (2013.01); B32B 2551/00 (2013.01); G02B 3/0012 (2013.01); G02B 2207/00 (2013.01); H01L 2227/32 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12044 (2013.01); H01S 5/005 (2013.01);
Abstract
The present disclosure describes optical element stack assemblies that include multiple substrates stacked one over another. At least one of the substrates includes an optical element, such as a DOE, on its surface. The stack assemblies can be fabricated, for example, in wafer-level processes.