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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10741516 B1

PDFFull Text
Date of Patent:
Aug. 11, 2020

Filed:

Nov. 13, 2018

Drive integrated circuit and display device including the same

Applicant:

Silicon Works Co., Ltd., Daejeon, KR;

Inventors:

Myeong Woo Oh, Daejeon, KR;

Yong Nam Choi, Daejeon, KR;

Dong Geon Lee, Daejeon, KR;

Dong Wook Kim, Daejeon, KR;

Jae Sup Han, Daejeon, KR;

Eun Ji Jo, Daejeon, KR;

Assignee:

SILICON WORKS CO., LTD., Daejeon, KR;

Attorney:

Harness, Dickey & Pierce, P.L.C.

Primary Examiner:

Ismail A Muse

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/00 (2006.01); H01L 27/12 (2006.01); H01L 25/18 (2006.01); H01L 23/498 (2006.01); H01L 23/528 (2006.01); H01L 27/02 (2006.01); H01L 23/522 (2006.01); G09G 3/3275 (2016.01); G09G 3/3266 (2016.01); G09G 3/36 (2006.01); G09G 3/32 (2016.01);
U.S. Cl.
CPC ...
H01L 24/14 (2013.01); H01L 23/4985 (2013.01); H01L 23/528 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/16 (2013.01); H01L 25/18 (2013.01); H01L 27/0255 (2013.01); H01L 27/0288 (2013.01); H01L 27/0296 (2013.01); H01L 27/124 (2013.01); G09G 3/32 (2013.01); G09G 3/3266 (2013.01); G09G 3/3275 (2013.01); G09G 3/3677 (2013.01); G09G 3/3688 (2013.01); G09G 2310/08 (2013.01); H01L 23/5226 (2013.01); H01L 23/5228 (2013.01); H01L 27/1255 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/1412 (2013.01); H01L 2224/14515 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01);
Abstract

Disclosed are a drive integrated circuit (IC) capable of being applied to all of a chip on film (COF) type and a chip on glass (COG) type and a display device including the drive IC. The drive IC includes an input pad part including a plurality of input bumps and an output pad part including a plurality of first diode parts, a plurality of second diode parts, and a plurality of output bumps. At least two of the plurality of output bumps overlap the plurality of first diode parts and the plurality of second diode parts, and a first output bump of the at least two output bumps is connected to at least one of the plurality of first diode parts and at least one of the plurality of second diode parts.

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