The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 11, 2020

Filed:

Mar. 08, 2019
Applicant:

Henkel Ip & Holding Gmbh, Duesseldorf, DE;

Inventors:

Xuan Hong, Irvine, CA (US);

Juliet G. Sanchez, Carson, CA (US);

Xinpei Cao, Irvine, CA (US);

Qizhuo Zhuo, Irvine, CA (US);

Assignee:

HENKEL IP & HOLDING GMBH, Duesseldorf, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01B 1/22 (2006.01); H01B 1/24 (2006.01); C09D 201/00 (2006.01); H01Q 17/00 (2006.01); H01B 1/02 (2006.01); C22C 1/10 (2006.01); C22C 26/00 (2006.01); C08G 73/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); C08G 73/0655 (2013.01); C09D 201/00 (2013.01); C22C 1/101 (2013.01); C22C 1/1005 (2013.01); C22C 26/00 (2013.01); H01B 1/02 (2013.01); H01B 1/22 (2013.01); H01B 1/24 (2013.01); H01Q 17/00 (2013.01); B22F 2998/10 (2013.01);
Abstract

Provided herein are conductive formulations wherein graphene has been added into the metal system, thereby reducing curing shrinkage and improving flexibility, without significantly affecting the EMI shielding performance thereof. In accordance with certain aspects of the present invention, there are also provided methods for filling a gap in an electronic package to achieve electromagnetic interference (EMI) shielding thereof, as well as the resulting articles shielded thereby. In certain aspects of the present invention, there are also provided articles prepared using invention formulations and methods.


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